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SIM8260G-M2 SIMCom eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmazva

ÚJ
Raktárkészlet: VAN
SIM8260G-M2 SIMCom eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmazva
  • SIM8260G-M2 SIMCom eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmazva
  • SIM8260G-M2 SIMCom eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmazva
  • SIM8260G-M2 SIMCom eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmazva
  • SIM8260G-M2 SIMCom eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmazva
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SIM8260G-M2 SIMCom Eredeti 5G Sub-6G modul a Qualcomm Snapdragon X62 alapú, 3GPP 5G Release 16 technológiát alkalmaz
  • Prohibited by the module manufacturer SIMCOM, we're not allowed to ship this product, or to provide any tech support, to the following countries/regions: Iran, North Korea, Cuba, Sudan, Syrian.
    SIM8260G-M2 SIMCom Original 5G Sub-6G module based on Qualcomm Snapdragon X62, Adopts 3GPP 5G Release 16 Technology
    SIM8260G-M2

    SIMCom 5G Sub-6G Module Based on Qualcomm Snapdragon X62Adopts 3GPP 5G Release 16 Technology

    SIM8260G-M2, front view

    TheSIM8260G-M2 is a multi-band 5G NR / LTE-FDD / LTE-TDD / HSPA+ module, supports R16 5G NSA / SA with a download speed up to 3.47Gbps. It has strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc. The module provides much flexibility and ease of integration for customer's applications.The SIM8260G-M2 adopts M.2 form factor, and AT commands are compatible with the SIM8200 series modules. This also minimizes the investments of customers and enables a short time-to-market. It is designed for applications that need high throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for many applications.

    Features
    • Standard M.2 B KEY interface
    • High-throughput data communication
    • AT commands of the SIM8260G-M2 are compatible with SIM8200 series modules
    Specifications
    SIM8262E-M2SIM8262A-M2SIM8260G-M2SIM8230G-M2
    5G Standard3GPP R163GPP R17
    ChipQualcomm Snapdragon X62Qualcomm Snapdragon X35
    Frequency band
    Sub-6Gn1, n3, n5, n7, n8, n20, n28, n38, n40, n41, n77, n78, n79n2, n5, n7, n12, n13, n14, n25, n30, n41, n48, n66, n71, n77, n78, n79n1, n2, n3, n5, n7, n8, n12, n13, n14, n18, n20, n25, n26, n28, n29, n30, n38, n40, n41, n48, n66, n71, n75, n76, n77, n78, n79n1, n2, n3, n5, n7, n8, n12, n13, n14, n18, n20, n25, n26, n28, n30, n38, n40, n41, n48, n66, n70, n71, n77, n78
    LTE-FDDB1, B3, B5, B7, B8, B18, B19, B20, B26, B28, B32B2, B4, B5, B7, B12, B13, B14, B25, B26, B29, B30, B66, B71B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B30, B66, B71
    LTE-TDDB38, B39, B40, B41, B42, B43B41, B46, B48B34, B38, B39, B40, B41, B42, B43, B46, B48B34, B38, B39, B40, B41, B42, B43, B48
    WCDMAB1, B5, B8B2, B4, B5B1, B2, B4, B5, B8, B19-
    GNSSGPS, GLONASS, Beidou, Galileo, and QZSSGPS, GLONASS, Beidou, Galileo, and NavIC
    Data rate
    Sub-6G2.4Gbps (DL)  /  500Mbps (UL)3.47Gbps (DL) / 460Mbps (UL)220Mbps (DL) / 100Mbps (UL)
    LTE1Gbps (DL)  /  200Mbps (UL)1.6Gbps (DL) / 200Mbps (UL)200Mbps (DL) / 50Mbps (UL)
    HSPA+42Mbps (DL)  /  5.76Mbps (UL)-
    Software functions
    Operating systemsWindows / Linux / Android
    Communication protocolsTCP/IP, IPV4, IPV6, Multi-PDP, FTP, FTPS, HTTP, HTTPS, MQTTS, DNS, SSL3.0
    Dial UpRNDIS, NDIS, PPP, MBIMRNDIS, ECM, PPP
    SMSSupports MT, MO, CB, Text, PDU
    Firmware upgradeSupports firmware upgrade via USB port
    Hardware Specifications
    SIM Card1.8V / 2.95V
    AntennaFor 3G / 4G / 5G / GNSS
    6 × IPEX-4 connectors4 × IPEX-4 connectors3 × IPEX-4 connectors
    Power Supply3.135V ~ 4.4V3.4V ~ 4.4V
    Form FactorM.2
    Dimensions42.0 × 30.0 × 2.3 (mm)52.0 × 30.0 × 2.3 (mm)42.0 × 31.4 × 3.4 (mm)
    Operating Temperature-30℃ ~ +70℃
    Applications
    Applicable regionsexcept AmericasAmericasGlobal
    The applicable regions above are for reference only, please choose the right module according to your local operator network coverage and supported frequency bands
    Application examplesCPE, Smart gateway, Live streaming, Remote medical treatment, Intelligent security
    Resources & Services
  • Brand
    SIMCom
    PartNumber
    SIM8260G-M2
    Raktárkészlet
    VAN
    Cikkszám
    RPI-WS32177
    Státusz
    ÚJ    
  • This is an M.2 module without antenna or base board.

    SIM8260G-M2 x1

    SIM8260G-M2
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